Learn about CVE-2017-18157, a Use After Free vulnerability in Qualcomm Snapdragon devices, potentially allowing unauthorized access and data compromise. Find mitigation steps and prevention measures here.
A potential situation of Use After Free Condition may arise in the Thermal Engine found in various Snapdragon devices such as Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear including MDM9206, MDM9607, MDM9650, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SD 845, SDX20.
Understanding CVE-2017-18157
This CVE involves a Use After Free vulnerability in Qualcomm Snapdragon devices.
What is CVE-2017-18157?
CVE-2017-18157 is a Use After Free vulnerability affecting various Snapdragon devices, potentially leading to security issues.
The Impact of CVE-2017-18157
The vulnerability could allow attackers to exploit the Thermal Engine in Snapdragon devices, compromising system integrity and data security.
Technical Details of CVE-2017-18157
This section provides detailed technical information about the CVE.
Vulnerability Description
The Use After Free Condition in the Thermal Engine of Snapdragon devices poses a security risk by allowing unauthorized access.
Affected Systems and Versions
Exploitation Mechanism
The vulnerability can be exploited by malicious actors to execute arbitrary code or gain unauthorized access to sensitive information.
Mitigation and Prevention
Protect your systems from CVE-2017-18157 with the following measures:
Immediate Steps to Take
Long-Term Security Practices
Patching and Updates