Learn about CVE-2017-18172 affecting Snapdragon Automobile and Snapdragon Mobile devices. Discover the impact, affected systems, and mitigation steps.
CVE-2017-18172 was published on October 23, 2018, by Qualcomm, Inc. This vulnerability affects Snapdragon Automobile and Snapdragon Mobile devices, potentially leading to an Integer Overflow or Wraparound in the System UI.
Understanding CVE-2017-18172
This CVE identifies a specific issue related to buffer checks in devices with screen size 1440x2560.
What is CVE-2017-18172?
The vulnerability arises from a flaw in the buffer check process in certain Snapdragon Automobile and Snapdragon Mobile versions, which can result in an Integer Overflow or Wraparound in the System UI.
The Impact of CVE-2017-18172
The vulnerability can be exploited to trigger an Integer Overflow or Wraparound in the System UI, potentially leading to system instability or unauthorized access.
Technical Details of CVE-2017-18172
This section delves into the technical aspects of the vulnerability.
Vulnerability Description
The issue occurs due to improper buffer checks in devices with specific screen sizes, potentially causing an Integer Overflow or Wraparound in the System UI.
Affected Systems and Versions
Exploitation Mechanism
The vulnerability can be exploited by manipulating buffer sizes in devices with the specified screen size, leading to an Integer Overflow or Wraparound in the System UI.
Mitigation and Prevention
Protecting systems from CVE-2017-18172 requires immediate actions and long-term security practices.
Immediate Steps to Take
Long-Term Security Practices
Patching and Updates