CVE-2017-18297 : Vulnerability Insights and Analysis
Learn about CVE-2017-18297 affecting Snapdragon Mobile devices by Qualcomm, Inc. Understand the impact, affected versions, and mitigation steps for this double memory free vulnerability.
Snapdragon Mobile devices by Qualcomm, Inc. are affected by a vulnerability that leads to double memory free when closing TEE SE API Session management.
Understanding CVE-2017-18297
This CVE involves a double free vulnerability in the Trusted Application Environment of Snapdragon Mobile devices.
What is CVE-2017-18297?
The vulnerability in Snapdragon Mobile devices results in memory being freed twice when closing the TEE SE API Session management.
The Impact of CVE-2017-18297
The double memory free issue can potentially lead to memory corruption and exploitation by malicious actors.
Technical Details of CVE-2017-18297
The technical aspects of the vulnerability in Snapdragon Mobile devices.
Vulnerability Description
Closing the TEE SE API Session management in affected Snapdragon Mobile versions results in memory being freed twice, leading to a double free vulnerability.
Affected Systems and Versions
- Product: Snapdragon Mobile
- Vendor: Qualcomm, Inc.
- Versions: SD 425, SD 430, SD 450, SD 625, SD 650/52, SD 820
Exploitation Mechanism
The vulnerability occurs due to improper memory management when closing the TEE SE API Session management.
Mitigation and Prevention
Steps to mitigate and prevent the CVE-2017-18297 vulnerability.
Immediate Steps to Take
- Apply security patches provided by Qualcomm, Inc.
- Monitor vendor security bulletins for updates and advisories.
Long-Term Security Practices
- Regularly update device firmware and software.
- Implement secure coding practices to prevent memory-related vulnerabilities.
Patching and Updates
- Install firmware updates from Qualcomm, Inc. to address the double memory free vulnerability.