Learn about CVE-2018-11264, a critical buffer overflow vulnerability affecting Qualcomm Snapdragon Automobile, Mobile, and Wear devices. Find out the impacted systems, exploitation risks, and mitigation steps.
CVE-2018-11264 was published on November 28, 2018, by Qualcomm, Inc. The vulnerability affects various Snapdragon devices due to a buffer overflow risk in the fingerprint code implemented in Ontario.
Understanding CVE-2018-11264
This CVE identifies a critical vulnerability in the fingerprint code of Snapdragon devices, potentially leading to a buffer overflow.
What is CVE-2018-11264?
The vulnerability stems from inadequate input validation for parameters received by the TZ module from the HLOS system on Snapdragon Automobile, Snapdragon Mobile, and Snapdragon Wear devices.
The Impact of CVE-2018-11264
The vulnerability poses a security risk to affected Snapdragon devices, potentially allowing attackers to exploit the buffer overflow issue.
Technical Details of CVE-2018-11264
Qualcomm Snapdragon devices running specific versions are susceptible to this vulnerability.
Vulnerability Description
The vulnerability arises from a lack of proper input validation for parameters received by the TZ module from the HLOS system, leading to a buffer overflow risk in the fingerprint code.
Affected Systems and Versions
Exploitation Mechanism
The vulnerability allows attackers to potentially execute arbitrary code or disrupt the normal operation of the affected devices.
Mitigation and Prevention
It is crucial to take immediate steps to address and prevent exploitation of this vulnerability.
Immediate Steps to Take
Long-Term Security Practices
Patching and Updates