CVE-2018-11847 : Vulnerability Insights and Analysis

A potential security threat exists where a malicious Trusted Application (TA) can manipulate QSEE kernel memory, potentially leading to memory corruption and compromising the Trusted Execution Environment (TEE) in various Snapdragon platforms.

Understanding CVE-2018-11847

This CVE involves a vulnerability that could allow an attacker to compromise the TEE in multiple Snapdragon platforms.

What is CVE-2018-11847?

A malicious TA can label QSEE kernel memory and connect it to EL0, potentially corrupting physical memory and compromising the entire TEE in Snapdragon devices.

The Impact of CVE-2018-11847

The vulnerability affects a wide range of Snapdragon platforms, including Snapdragon Auto, Compute, Connectivity, Consumer Electronics Connectivity, Consumer IoT, Industrial IoT, IoT, Mobile, Voice & Music, Wearables, and Wired Infrastructure and Networking.

Technical Details of CVE-2018-11847

This section provides more technical insights into the vulnerability.

Vulnerability Description

The vulnerability allows a malicious TA to manipulate QSEE kernel memory, leading to potential memory corruption and TEE compromise.

Affected Systems and Versions

Affected versions include IPQ8074, MDM9206, MDM9607, MDM9650, MDM9655, MSM8909W, MSM8996AU, QCA8081, SD series, and more.

Exploitation Mechanism

Attackers can exploit this vulnerability by manipulating QSEE kernel memory and connecting it to EL0, potentially compromising the TEE.

Mitigation and Prevention

Protecting systems from this vulnerability is crucial.

Immediate Steps to Take

Update affected devices with patches provided by Qualcomm.
Monitor for any suspicious activities or unauthorized access.

Long-Term Security Practices

Regularly update software and firmware to mitigate potential vulnerabilities.
Implement access controls and restrictions to prevent unauthorized access.

Patching and Updates

Stay informed about security bulletins and updates from Qualcomm to address this vulnerability.