CVE-2019-10612 : Vulnerability Insights and Analysis

The UTCB object in various Snapdragon platforms is vulnerable to a stack overflow issue, potentially leading to memory corruption.

Understanding CVE-2019-10612

What is CVE-2019-10612?

The vulnerability lies in the UTCB object's function pointer, which can be exploited by a stack overflow in multiple Snapdragon platforms.

The Impact of CVE-2019-10612

The vulnerability could allow attackers to compromise memory resources in affected Snapdragon devices, posing a security risk to users and data.

Technical Details of CVE-2019-10612

Vulnerability Description

The UTCB object's function pointer is used by the reaper to release memory resources, but it can be compromised by a stack overflow, affecting various Snapdragon platforms.

Affected Systems and Versions

Affected Systems: Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wired Infrastructure and Networking
Affected Versions: MDM9205, MDM9650, QCS605, SA6155P, SC8180X, SDA845, SDM670, SDM710, SDM845, SDM850, SDX55, SM6150, SM7150, SM8150, SM8250, SXR1130, SXR2130

Exploitation Mechanism

The vulnerability can be exploited through a stack overflow in the UTCB object's function pointer, potentially leading to memory corruption.

Mitigation and Prevention

Immediate Steps to Take

Apply patches provided by Qualcomm to address the vulnerability.
Monitor Qualcomm's security bulletins for updates and advisories.

Long-Term Security Practices

Regularly update software and firmware on affected devices.
Implement network security measures to prevent unauthorized access.

Patching and Updates

Stay informed about security bulletins and updates from Qualcomm.