Learn about CVE-2019-10625, a vulnerability in Qualcomm Snapdragon Auto, Compute, Consumer IOT, Industrial IOT, Mobile, Wearables. Find out the impact, affected systems, and mitigation steps.
Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables by Qualcomm, Inc. are affected by a vulnerability related to out-of-bound access in diag services.
Understanding CVE-2019-10625
This CVE involves a buffer over-read issue in diag services, impacting various Qualcomm Snapdragon products and versions.
What is CVE-2019-10625?
The vulnerability occurs due to improper reallocation of the DCI command buffer capacity, leading to out-of-bound access in diag services within the specified Qualcomm Snapdragon products and versions.
The Impact of CVE-2019-10625
The vulnerability could allow malicious actors to exploit the out-of-bound access in diag services, potentially leading to unauthorized access, data leaks, or system crashes.
Technical Details of CVE-2019-10625
The technical aspects of the vulnerability are as follows:
Vulnerability Description
The vulnerability involves out-of-bound access in diag services when the DCI command buffer reallocation is not properly done with the required capacity.
Affected Systems and Versions
Exploitation Mechanism
The vulnerability can be exploited by attackers leveraging the out-of-bound access in diag services to potentially compromise the affected systems.
Mitigation and Prevention
To address CVE-2019-10625, the following steps are recommended:
Immediate Steps to Take
Long-Term Security Practices
Patching and Updates