CVE-2019-14037 : Vulnerability Insights and Analysis

Close and bind operations on a socket can lead to a Use-After-Free vulnerability affecting multiple Qualcomm Snapdragon platforms.

Understanding CVE-2019-14037

What is CVE-2019-14037?

The vulnerability arises from the execution of close and bind operations on a socket, resulting in a Use-After-Free situation in various Qualcomm Snapdragon platforms.

The Impact of CVE-2019-14037

This vulnerability affects a wide range of Qualcomm Snapdragon products, potentially leading to security breaches and unauthorized access.

Technical Details of CVE-2019-14037

Vulnerability Description

The issue involves a Use-After-Free condition triggered by close and bind operations on a socket in Snapdragon Auto, Compute, Connectivity, Consumer Electronics Connectivity, Consumer IoT, Industrial IoT, IoT, Mobile, Voice & Music, and Wearables.

Affected Systems and Versions

Products: Snapdragon Auto, Compute, Connectivity, Consumer Electronics Connectivity, Consumer IoT, Industrial IoT, IoT, Mobile, Voice & Music, Wearables
Versions: APQ8009, APQ8053, APQ8096AU, APQ8098, MDM9206, MDM9207C, MDM9607, MDM9640, MDM9650, MSM8905, MSM8909W, MSM8996, MSM8996AU, QCN7605, QCN7606, QCS605, SC8180X, SDA660, SDA845, SDM439, SDM630, SDM636, SDM660, SDM670, SDM710, SDM845, SDX20, SDX24, SDX55, SM8150, SXR1130

Exploitation Mechanism

The vulnerability is exploited through the execution of close and bind operations on a socket, leading to a Use-After-Free situation.

Mitigation and Prevention

Immediate Steps to Take

Apply patches provided by Qualcomm promptly to address the vulnerability.
Monitor Qualcomm's security bulletins for updates and advisories.

Long-Term Security Practices

Regularly update software and firmware on affected devices.
Implement network segmentation and access controls to limit exposure to potential attacks.

Patching and Updates

Ensure all affected systems are updated with the latest patches from Qualcomm to mitigate the vulnerability.