Learn about CVE-2019-14074, a critical heap overflow vulnerability in Qualcomm Snapdragon chipsets due to unchecked packet lengths. Find mitigation steps and patching details here.
Snapdragon chipsets by Qualcomm are affected by a heap overflow vulnerability due to a lack of packet length check in the diag command handler.
Understanding CVE-2019-14074
This CVE identifies a critical vulnerability in various Snapdragon chipsets that could be exploited by attackers.
What is CVE-2019-14074?
The vulnerability in the diag command handler in Snapdragon chipsets allows for a heap overflow due to unchecked packet lengths received from users.
The Impact of CVE-2019-14074
This vulnerability could be exploited by malicious actors to execute arbitrary code, leading to a potential compromise of the affected devices.
Technical Details of CVE-2019-14074
Qualcomm's Snapdragon chipsets are affected by a heap overflow vulnerability due to unchecked packet lengths in the diag command handler.
Vulnerability Description
The vulnerability arises from a lack of validation on the length of packets received from users, resulting in a heap overflow.
Affected Systems and Versions
Exploitation Mechanism
Attackers can exploit this vulnerability by sending specially crafted packets to the affected devices, triggering a heap overflow and potentially executing malicious code.
Mitigation and Prevention
To address CVE-2019-14074, immediate actions and long-term security practices are recommended.
Immediate Steps to Take
Long-Term Security Practices
Patching and Updates