Learn about CVE-2019-16863 affecting STMicroelectronics TPM devices. Find out how attackers can extract ECDSA private keys and steps to mitigate this security risk.
TPM devices produced by STMicroelectronics, specifically the ST33TPHF2ESPI model, were found to have a vulnerability that allows attackers to extract the ECDSA private key using a timing attack on or before September 12, 2019. This vulnerability occurs due to mishandling of ECDSA scalar multiplication and is commonly referred to as TPM-FAIL.
Understanding CVE-2019-16863
TPM-FAIL vulnerability in STMicroelectronics TPM devices.
What is CVE-2019-16863?
CVE-2019-16863 is a vulnerability in STMicroelectronics ST33TPHF2ESPI TPM devices that enables attackers to extract the ECDSA private key through a timing attack.
The Impact of CVE-2019-16863
This vulnerability poses a significant security risk as it allows malicious actors to compromise the security of systems utilizing affected TPM devices.
Technical Details of CVE-2019-16863
Details regarding the vulnerability and its implications.
Vulnerability Description
STMicroelectronics ST33TPHF2ESPI TPM devices before September 12, 2019, are susceptible to an attack that enables the extraction of the ECDSA private key due to mishandling of ECDSA scalar multiplication.
Affected Systems and Versions
Exploitation Mechanism
The vulnerability allows attackers to exploit a side-channel timing attack to extract the ECDSA private key from the affected TPM devices.
Mitigation and Prevention
Steps to mitigate the CVE-2019-16863 vulnerability.
Immediate Steps to Take
Long-Term Security Practices
Patching and Updates