Telink Semiconductor's BLE SDK versions before November 2019 have a vulnerability in the Bluetooth Low Energy Secure Manager Protocol (SMP), enabling a denial of service attack. Learn about the impact, affected systems, exploitation, and mitigation steps.
Telink Semiconductor's BLE SDK versions released before November 2019 have a vulnerability in their implementation of the Bluetooth Low Energy Secure Manager Protocol (SMP), allowing for a denial of service attack.
Understanding CVE-2019-19196
Telink Semiconductor's BLE SDK versions prior to November 2019 are susceptible to a buffer overflow vulnerability in the Bluetooth Low Energy Secure Manager Protocol (SMP), potentially leading to a denial of service.
What is CVE-2019-19196?
The vulnerability in Telink Semiconductor's BLE SDK versions allows an attacker within radio range to exploit a buffer overflow by sending specially crafted packets, resulting in a denial of service (crash) due to an accepted key size exceeding 16 bytes.
The Impact of CVE-2019-19196
This vulnerability could be exploited by an attacker within radio range, leading to a denial of service (DoS) attack on affected devices utilizing Telink Semiconductor's BLE SDK versions released before November 2019.
Technical Details of CVE-2019-19196
Telink Semiconductor's BLE SDK versions prior to November 2019 are affected by a critical vulnerability in the implementation of the Bluetooth Low Energy Secure Manager Protocol (SMP).
Vulnerability Description
The vulnerability allows an attacker within radio range to trigger a denial of service (DoS) attack by exploiting a buffer overflow in the SMP implementation.
Affected Systems and Versions
Exploitation Mechanism
Mitigation and Prevention
It is crucial to take immediate steps to address and prevent the exploitation of CVE-2019-19196.
Immediate Steps to Take
Long-Term Security Practices
Patching and Updates