Learn about CVE-2019-2339, an out-of-bound access vulnerability in Snapdragon Auto, Compute, Connectivity, Consumer IOT, Industrial IOT, Mobile, Wired Infrastructure by Qualcomm, Inc. affecting MDM9205, QCS404, QCS605, and more.
Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wired Infrastructure and Networking by Qualcomm, Inc. are affected by an out-of-bound access vulnerability due to inadequate size checking of the whitelist array.
Understanding CVE-2019-2339
This CVE involves improper restriction of operation within the bounds of memory in QTEE.
What is CVE-2019-2339?
The vulnerability in various Qualcomm products allows attackers to access out-of-bound memory due to insufficient validation of the whitelist array's size.
The Impact of CVE-2019-2339
The vulnerability could be exploited by malicious actors to execute arbitrary code, leading to potential system compromise and unauthorized access to sensitive information.
Technical Details of CVE-2019-2339
The technical details of this CVE include:
Vulnerability Description
The issue arises from a lack of proper size validation of the whitelist array while reading image elf segments in the affected Qualcomm products.
Affected Systems and Versions
Exploitation Mechanism
Attackers can exploit this vulnerability by manipulating the size of the whitelist array, leading to out-of-bound memory access and potential code execution.
Mitigation and Prevention
To address CVE-2019-2339, consider the following steps:
Immediate Steps to Take
Long-Term Security Practices
Patching and Updates