Learn about CVE-2020-11166 affecting Qualcomm Snapdragon products. Discover the impact, affected systems, exploitation mechanism, and mitigation steps for this out-of-bound read vulnerability.
Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables by Qualcomm, Inc. are affected by a potential out-of-bound read exception due to an unusually large number of padding octets in the beginning of ROHC header.
Understanding CVE-2020-11166
This CVE involves a buffer over-read issue in the data modem of the affected Qualcomm products.
What is CVE-2020-11166?
The vulnerability arises when a User Equipment (UE) receives an abnormally high number of padding octets at the start of the ROHC header.
The Impact of CVE-2020-11166
The vulnerability could potentially lead to a security breach, allowing attackers to exploit the out-of-bound read exception.
Technical Details of CVE-2020-11166
This section provides detailed technical insights into the vulnerability.
Vulnerability Description
The issue involves an out-of-bound read exception triggered by an excessive number of padding octets in the ROHC header.
Affected Systems and Versions
Exploitation Mechanism
Attackers can exploit this vulnerability by crafting and sending specially designed packets with an excessive number of padding octets to trigger the out-of-bound read exception.
Mitigation and Prevention
Protecting systems from CVE-2020-11166 requires immediate actions and long-term security practices.
Immediate Steps to Take
Long-Term Security Practices
Patching and Updates