CVE-2020-11175 : What You Need to Know
Learn about CVE-2020-11175, a use-after-free vulnerability in Qualcomm Snapdragon chips affecting various products and versions. Find mitigation steps and patching details here.
A use-after-free vulnerability in Qualcomm Snapdragon chips affecting various products and versions.
Understanding CVE-2020-11175
What is CVE-2020-11175?
This CVE involves a use-after-free issue in the Bluetooth transport driver of Qualcomm Snapdragon chips, leading to potential security risks.
The Impact of CVE-2020-11175
The vulnerability could allow attackers to execute arbitrary code or cause a denial of service by exploiting the improper handling of timers in the Bluetooth transport driver.
Technical Details of CVE-2020-11175
Vulnerability Description
The issue occurs when a method in the Bluetooth transport driver is accessed after the object has been deleted due to improper timer handling.
Affected Systems and Versions
- Affected Products: Snapdragon Auto, Compute, Consumer IOT, Industrial IOT, Mobile, Wearables
- Affected Versions: APQ8009W, MSM8909W, QCS605, QM215, and more
Exploitation Mechanism
Attackers can exploit this vulnerability by accessing a method in the Bluetooth transport driver after the object has been deleted due to timer mishandling.
Mitigation and Prevention
Immediate Steps to Take
- Apply patches provided by Qualcomm promptly.
- Monitor Qualcomm's security bulletins for updates and advisories.
Long-Term Security Practices
- Regularly update firmware and software on affected devices.
- Implement network segmentation and access controls to limit exposure.
Patching and Updates
Qualcomm has released patches addressing this vulnerability. Ensure all affected devices are updated with the latest firmware and software.