Learn about CVE-2020-13470 affecting Gigadevice GD32F103 and GD32F130 devices, allowing physical attackers to extract data via bonding wires probing and de-obfuscation.
Gigadevice GD32F103 and GD32F130 devices have a vulnerability that allows physical attackers to extract data through probing bonding wires and de-obfuscating observed data.
Understanding CVE-2020-13470
This CVE involves a security issue in Gigadevice GD32F103 and GD32F130 devices that can be exploited by physical attackers.
What is CVE-2020-13470?
The vulnerability in Gigadevice GD32F103 and GD32F130 devices enables attackers to extract data by probing easily accessible bonding wires and de-obfuscating the data they observe.
The Impact of CVE-2020-13470
This vulnerability poses a risk of data extraction to unauthorized individuals who have physical access to the affected devices.
Technical Details of CVE-2020-13470
This section provides more technical insights into the CVE.
Vulnerability Description
The vulnerability allows physical attackers to extract data by probing bonding wires and de-obfuscating observed data on Gigadevice GD32F103 and GD32F130 devices.
Affected Systems and Versions
Exploitation Mechanism
Attackers can exploit this vulnerability by physically accessing the devices and probing the bonding wires to extract data.
Mitigation and Prevention
Protecting against CVE-2020-13470 is crucial to prevent data extraction through physical attacks.
Immediate Steps to Take
Long-Term Security Practices
Patching and Updates