CVE-2023-21639 involves memory corruption in Audio due to processing sva_model_serializer with a memory size passed by HIDL client. Impact: Low complexity, medium severity base score of 6.7, high availability, confidentiality, and integrity impact.
This CVE-2023-21639 was published on July 4, 2023, by Qualcomm, Inc. It involves memory corruption in Audio due to processing sva_model_serializer with a memory size passed by HIDL client.
Understanding CVE-2023-21639
This vulnerability affects multiple versions and platforms under the Snapdragon product line by Qualcomm, Inc.
What is CVE-2023-21639?
The vulnerability stems from a buffer copy operation without checking the size of the input in the Audio component.
The Impact of CVE-2023-21639
The impact is classified as low complexity with a medium severity base score of 6.7 according to the CVSS v3.1 metrics. It has a high availability, confidentiality, and integrity impact with high privileges required for exploitation.
Technical Details of CVE-2023-21639
This section delves into the specific technical aspects of the vulnerability.
Vulnerability Description
The vulnerability involves memory corruption in Audio while processing sva_model_serializer using memory size passed by the HIDL client.
Affected Systems and Versions
The following Qualcomm Snapdragon products and versions are affected:
Exploitation Mechanism
The vulnerability can be exploited locally with no user interaction required but with high privileges.
Mitigation and Prevention
Taking immediate steps and implementing long-term security practices are crucial to mitigate the impact of CVE-2023-21639.
Immediate Steps to Take
Long-Term Security Practices
Patching and Updates
Qualcomm has released a bulletin addressing the July 2023 security vulnerabilities. Ensure that the affected systems are updated with the latest patches provided by the vendor.