Discover the high-severity Bluetooth vulnerability (CVE-2023-33092) in Qualcomm Snapdragon products, impacting confidentiality, integrity, and availability. Learn the technical details and mitigation steps.
Bluetooth vulnerability in Qualcomm Snapdragon products.
Understanding CVE-2023-33092
This CVE involves memory corruption in Bluetooth, triggered when processing a pin reply with a pin code larger than expected.
What is CVE-2023-33092?
The CVE-2023-33092 is a high-severity vulnerability affecting Qualcomm Snapdragon products. It occurs due to memory corruption during the processing of a pin reply in Bluetooth, specifically when the received pin code from the APP layer is larger than the expected size.
The Impact of CVE-2023-33092
This vulnerability has a CVSSv3.1 base score of 8.4, categorizing it as a high-severity issue. With a low attack complexity and local attack vector, it poses a significant risk to confidentiality, integrity, and availability of the affected systems.
Technical Details of CVE-2023-33092
This section provides an insight into the vulnerability, affected systems, and the exploitation mechanism.
Vulnerability Description
The vulnerability stems from memory corruption during the processing of a pin reply in Bluetooth, triggered by an oversized pin code received from the APP layer.
Affected Systems and Versions
Qualcomm Snapdragon products, including Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, and Snapdragon Mobile, are among the affected platforms. Various versions within these product lines are impacted by this vulnerability.
Exploitation Mechanism
The vulnerability is exploited by sending a pin code larger than the expected size to the Bluetooth HOST, leading to memory corruption and potentially harmful consequences.
Mitigation and Prevention
Here are the steps to address and prevent exploitation of CVE-2023-33092.
Immediate Steps to Take
Long-Term Security Practices
Patching and Updates